After you have thoroughly analyzed the Samsung Galaxy S7 , the Canadian Chipworks was subjected to the same treatment also the version edge smartphone – announced in Barcelona last February 21 – through a thorough teardown .
Unlike other sites (iFixit all) interested in assessing the repairability of devices, Chipworks focuses on the individual components that comprise them and their technical characteristics. The teardown has focused in particular on the camera , true workhorse of the new device in which a reduction of the number of pixels (16 to 12 megapixels compared to the Galaxy S6 ) it was accompanied by an improvement in performance. This is due to pass from 1.12 pM size for each S6 pixels to the current 1.4 uM . Moreover, Chipworks believes that the rear sensor is precisely the model IMX260 produced by Sony .
another aspect analyzed was the technology PDAF , ovver the Dual Phase Detection Pixels , first introduced on the market by Canon in 2013 with DSLR EOS 70D and now adapted to mobile devices sensors allocating the entire pixel matrix for the collection of data for the auto-focus system. What has most impressed the Chipworks team was the ability of engineers to place such technology within pixels of 1.4 microns.
More discoveries made inside the edge of the Galaxy S7 body concern presence of the controller of the touch screen S6SMC41X , version MSM8996 of the Qualcomm Snapdragon 820 processor and memory RAM LPDDR4 curiously made by the external supplier Hynix and not the same Samsung.
one particular: Chipworks emphasizes the presence of a substantial welding between the RAM and the chipset , probably due to the intention to avoid heat dissipation problems.
the dedicated to teardown team has promised more details on other components of the Samsung Galaxy S7 edge over the next few days.
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